Cell-to-Pack is the direct connection of individual battery cells to the battery cooling plate, and it is a new trend in the electric vehicle market. It improves performance by providing higher pack energy density, improved part complexity, lower thermal loads on the battery pack, and simpler, lower cost pack manufacturing. To support Cell-to-Pack (CTP), new thermally conductive adhesive technology is required. These adhesives must have high thermal conductivity with low viscosity, like the new urethane adhesive we have developed. Experts working on the design and manufacture of battery systems, especially automotive OEMs, would find these new developments important.
This session during our Fall EV Engineering virtual conference, presented by Parker Lord, will highlight the key factors that are motivating EV manufacturers to move away from traditional modular designs to embrace new CTP designs.
Other sessions in our Spring Virtual Conference include:
Interconnect solutions for the production of state-of-the-art battery modules
Overview of state-of-the-art assembly technologies for batteries, including pot/resistance welding, US-Bonding, laser and laserbonding. For any type of battery, it is crucial to reliably interconnect the individual cells to the powertrain and the BMS. F&K DELVOTEC offers a wide range of solutions for the design and production of battery cell interconnects.
In this session, we will present in detail the laser process, the advantages of the laserbonder concept and show application examples such as:
- BMS contact with nickel tape
- Assembly of MERSEN Infinity Cells with Delvotec Laserbonders
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View the full list of Electric Vehicle Engineering Fall Virtual Conference sessions here.
Streamed live from October 17-20, 2022, conference content will cover the electric vehicle engineering supply chain and ecosystem, including motor and power electronics design and manufacturing, cell development, battery systems, testing, powertrains, thermal management, circuit protection, wires and cables, EMI/EMC and more.
